One other semi-technical point......

Unless the system is using a desktop case, the cpu and heat sink will be
standing on edge, which means that gravity will be spending 24 hours a day
trying to pull the heat sink down to the floor.
I am dubious of the cohesion and shear factors of a piece of double sided
tape.

----- Original Message -----
From: "Anthony Garvey" <[log in to unmask]>

> On the subject of CPU heatsinks (again) ...here are some interesting
> figures:
>
> Resistance factors: (lower is better)
>
> thermal compound=0.8
> thermal grease=0.9
> thermal tape=2.7
> air=2.9
>
> According to these figures, tape is better than nothing - but not by much.
>
> There is a good article that supports these numbers at:
> http://heatsink-guide.com/paste.htm
>
> > >I had a PC Power and Cooling CPU cooler for a 233MMX that started
> > >making noise. The fan is vacuum packed...no screws and there is
> > >nothing I can do to fix it so I called them up. They had me send
> > >it to them for repair but then decided to send me a new
> > >replacement . The replacement is the same as the one I sent in
> > >but it has no mechanical means of securing it... just a piece of
> > >tape stuck to the bottom. They say this is a thermal tape that
> > >Air Locks the cooler to the CPU. This idea seems really cheap to
> > >me and I am quite surprised that PC Power & Cooling is selling
> > >something like this particularly in light of the fact that once
> > >you use the tape you must replace it.
> >
> > >I don't trust this tape idea so I will probably try using cable
> > >locks to secure it to the Socket 7. I can't remove the Fan so I
> > >can't get a wire in there even if I had one. Anybody see or use
> > >these things ?...and if so with what results.
> >
> > Mark:
> >
> > The tape is as good or better than any other method of mounting.
> > The thermal coupling is designed to match that of mechanical
> > coupling plus thermal compound, and tape is a lot easier to use.
> > If you use mechanical means to secure the cooler, you MUST use
> > thermal compound or Silpad (tm) type materials IMHO.
> >
> > jan lambert
>
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