On 26 Feb 98 at 8:17, Larry Fisk wrote:

>    Seems like someone could come up with a heatsink that
>  is molded to the top of the chip and would make better contact.

  All of the heat-generating circuitry is under the raised "heat
spreader".  A tighter fit to the rest of the package would not
actually achieve any better heat transfer.

David G