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Subject:
From:
David Gillett <[log in to unmask]>
Reply To:
PCBUILD - PC Hardware discussion List <[log in to unmask]>
Date:
Tue, 3 Mar 1998 15:42:19 -0800
Content-Type:
text/plain
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On 26 Feb 98 at 8:17, Larry Fisk wrote:

>    Seems like someone could come up with a heatsink that
>  is molded to the top of the chip and would make better contact.

  All of the heat-generating circuitry is under the raised "heat
spreader".  A tighter fit to the rest of the package would not
actually achieve any better heat transfer.

David G

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