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Date: | Tue, 8 Jun 1999 16:54:18 -0700 |
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On 8 Jun 99, at 14:17, Brad Boutwell wrote:
> > .... Leaving the top/back off the casing increases airflow and cuts down
> > on heat...great for the longevity of the processor, or if you are an avid
> > overclocker...
>
> This is rather poor advice.
>
> Leaving the case off will increase *overall* airflow and lower *air*
> temperature inside the case.
> But it also tends to decrease the specific airflow over hot components
> such
> as the CPU, and so some of that air temperature reduction may come at a cost
> of increased *component* temperature -- not good for longevity at all.
>
> **********
>
> I'm afraid I don't quite understand your reasoning. You do understand that
> I am referring to the casing of the processor, not the chassis that the
> motherboard is located in. How could removing a buffering layer from the
> cpu possibly reduce airflow over the cpu? This is the entire reason for
> Intel's removal of the case. All subsequent processors are to have minimal
> housings as well, if I understand correctly.
I'm sorry -- it sounded like you were recommending running the machine with
the case off. I see now that you were actually referring to how Intel
packages the CPU.
In the immortal words of Emily Latella: Never mind.
David G
PCBUILD's List Owner's:
Bob Wright<[log in to unmask]>
Drew Dunn<[log in to unmask]>
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